One of the ways that we got to know of the existence of a name like LeEco in the world of smartphones was when they decided to partner up who the engineers over at CoolPad to jointly launch some sets of devices and having done two of such joint projects, it seems that the union is something that none of them wishes to let go fast as there is a new leak coming out of China to suggest that they are yet in the works for another smartphone.
If you recall, the first project they did together was the Cool1 Dual and just last month, they made the second one – Cool 1C – official. The new one that they are rumoured to be making wood be called Cool 1S and unlike the former two that were just like midrange and entry level offerings, this one is supposed be a true flagship.
Apparently, under the hood pf this new one would be things such as a QUALCOMM snapdragon 821 chipset, Android 6.0.1 Marshmallow and a 5.5-inch f scree which has the 1080p technology on top of that. As if things aren’t hot enough, there is supposed to be either 4 or 6GB of RAM allotted to the CPU with up to 128GB storage option, pulling power from a 4000mAh battery unit.
Without announcement, we have no info as to pre or availability s of the time of writing.